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Research and Markets: Reverse Costing Report on the Micro-Bolometer ISC0601B, 320x240 Pixels Supplied by FLIR
By: Business Wire
Nov. 23, 2012 06:09 AM
Research and Markets (http://www.researchandmarkets.com/research/stgvbd/flir_isc0601b) has announced the addition of the "Flir ISC0601B Micro-bolometer Teardown & Reverse Costing Analysis" report to their offering. System Plus Consulting is proud to publish a reverse costing report on the micro-bolometer ISC0601B, 320x240 pixels supplied by FLIR. Flir micro-bolometer technology is based on a vanadium oxide material, with micro-machined structures. Each pixel contains active membranes suspended at 2µm above the readout circuit. This micro-bolometer is suitable for various applications including thermography, industrial inspection, Building & Renewable Energy, Border Security and coastal surveillance, automotive, etc. This report provides complete teardown of the Flir ISC0601B sensor with: - Detailed photos - Material analysis - Manufacturing Process Flow - In-depth economical analysis - Manufacturing cost breakdown Selling price estimation The micro-bolometer is part of the FLIR i7 thermal imaging camera. A reverse costing report on the i7 camera is available separately. Key Topics Covered: Table of Contents Glossary 1. Overview/ Introduction - Glossary - Executive Summary - Reverse Costing Methodology 2. Company Profile - ULIS Profile - On Semiconductor 3. Physical Analysis - Synthesis of the Physical Analysis - IR CameraI7 - Package - Package x-ray - Package Front Side - Package rear side - Pread Out IC - ROIC Functions - ROIC Technology - Micro Bolometer - Reflector - Structure of Pixel - Micro bridge - Contact Structure - Compensation Pixels - Principle Operation - Physical Data Summary 4. Manufacturing Process Flow - Global Overview - ROIC Process Flow - Description of the ROIC Water Fabrication Unit - Description of the Micro-balomerter Process Flow - Description of the Micro-balomerter Water fabrication Unit - Packaging 5. Cost Analysis - Main Steps of Economic Analysis - Yields Explanation - Die per wafer & probe test - ROIC Wafer Front-End cost 6. 200mm Micro-Bolometer Cost Analysis - Micro Bolometer Wafer Cost - Micro Bolometer Step Cost - Micro Bolometer Equipment Cost - Micro Bolometer Consumable Cost - Back-End 1: Packaging, Final test - Component Cost ( FE+BE 0 + BE 1) - Yields Synthesis 7. Micro Bolometer Price Estimation - Manufacturer Financial Ratios - Estimated manufacturer Price - Synthesis of the cost Analysis 8. Conculsion For more information visit http://www.researchandmarkets.com/research/stgvbd/flir_isc0601b
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