Today's Top SOA Links
ScaleMP to Exhibit at Cloud Expo New York
ScaleMP offers a new, revolutionary computing paradigm
By: Elizabeth White
Dec. 31, 2012 09:00 AM
SYS-CON Events announced today that ScaleMP, a leading provider of virtualization solutions for high-end computing, will exhibit at SYS-CON's 12th International Cloud Expo, which will take place on June 10-13, 2013, at the Javits Center in New York City, New York.
ScaleMP is the leader in virtualization for high-end computing, providing maximum performance and lower total cost of ownership (TCO). The innovative Versatile SMPTM (vSMP) architecture aggregates multiple independent systems into a single virtual system, delivering an industry-standard, high-end symmetric multiprocessing (SMP) computer. Using software to replace custom hardware and components, ScaleMP offers a new, revolutionary computing paradigm.
For more information, visit http://www.scalemp.com.
A Rock Star Faculty, Top Keynotes, Sessions, and Top Delegates!
The growth and success of Cloud Computing will be on display at the upcoming Cloud Expo conference and exhibition in New York City, New York, June 10-13, 2013.
The recent Cloud Expo at the Santa Clara Convention Center in Santa Clara, CA, was the largest Cloud Computing conference ever produced with more sponsors, exhibitors and delegates than all other Cloud events of the year combined!
Cloud Expo New York will attract more than 10,000 delegates from 48 countries and over 200 sponsors and exhibitors!
All main layers of the Cloud ecosystem will be represented at the 12th International Cloud Expo - the infrastructure players, the platform providers, and those offering applications, and they'll all be here to speak, sponsor, exhibit and network.
"Cloud Expo was announced on February 24, 2007, the day the term ‘cloud computing' was coined," said Fuat Kircaali, founder and chairman of SYS-CON Events, Inc. "Cloud has become synonymous with ‘computing' and ‘software' in two short years, and this event has become the new PC Expo, Comdex, and InternetWorld of our decade. By 2013, more than 50,000 delegates per year will be attending Cloud Expo."
About SYS-CON Media & Events
Cloud Expo, Cloud Expo East, Cloud Expo West, Cloud Expo New York, Cloud Expo Silicon Valley, Cloud Expo Europe, Cloud Expo Tokyo, Cloud Expo Prague, Cloud Expo Hong Kong, Cloud Expo Sao Paolo are trademarks and /or registered trademarks (USPTO serial number 85009040) of Cloud Expo, Inc.
Reader Feedback: Page 1 of 1
Subscribe to the World's Most Powerful Newsletters
Subscribe to Our Rss Feeds & Get Your SYS-CON News Live!
SYS-CON Featured Whitepapers
Most Read This Week